Featuring an advisory panel and speaker faculty that includes:

  • Alvaro-Maury Alvaro Maury
    Senior Manager, Continuous Improvement
    Silterra
  • Yong L.W. Yong
    Chief Technology Officer
    Carsem
  • Ariel-Guerro Ariel Guerro
    Manager, Continuous Improvement
    Advanced Micro Devices

Operational Excellence and Technical Advancements Throughout the Semiconductor Value Chain

4.6 percent growth in Semiconductor sector in 2011

After a phenomenal 2010, 2011 might be just the year that the semiconductor needs. Industry watchers predict that the 2011 worldwide semiconductor sales are likely to grow by 4.6%, following an robust 31.5% growth in 2010. But what seems to be driving this growth?

Mario Bolanos, Director of Equipment Engineering for Texas Instruments, seems to think that the recent downturn is mostly complete and 2011 will be a year of growth for the industry and for Texas Instruments.

“Capacity will continue to be tight over the next few years and we believe the recent additions to our capacity (nearly $5 billion of Analog capacity since 2009) combined with our flexible manufacturing strategy is a competitive advantage for us. System on Chip (SoC) and 3D packaging will be critical for the industry. Handheld devices, such as cell phones and tablet computers, with increasing demands from video and gaming applications are driving the need for three-dimension integration. Texas Instruments packaging is as an integral part of our design process and enables further advances in miniaturization, reliability, high performance, low power and cost.”

Lam Wai Yong, Chief Technology Officer for Carsem, explains that going forward, the cycles of ups and downs will become shorter due to better inventory management and cautiousness in the marketplace.

“Step and continuous improvement as well as the ability to adapt and change is a must for survival and to remain competitive in all industry and especially so in the semi-conductors industry. We need to stay with the speed of advancement of our competitors, Customer and Marketplace or be left behind.”

Tapping on Local Potential: Examining Key Requirements to Advance High-Value Added Engineering in Malaysia

  • Collective action from the industry: What can we do to develop a skilled workforce?
  • Developing local centers of excellence
  • Identifying which skills sets and areas of expertise to emphasise

Mario Bolanos, Director, Equipment Engineering, Texas Instruments

Substrate Technologies for Advanced Packaging

  • The quest of better performance, smaller size and lower cost have been the drivers to push the Moore’s law forward. Organic and silicon substrates have played a key role in the development of the microelectronics packaging. The substrate technologies help to accommodate the die pad with the PCB for communication. The organic substrate is currently the main engine for manufacturing. It constitutes a significant portion of microelectronics packaging cost and offers many opportunities for cost reductions. The silicon substrate offers an effective mean for advanced packaging in the near future. This presentation will present the evolution of substrate technologies to micro-electronics packaging.

Dr. Lee TeckKheng, Deputy Director, Technology, Institute of Technical Education, Singapore

Balancing Challenges of Short Product Lifecycles against Long Manufacturing Cycle through Proactive Planning and Marketing

  • Evaluating impact of increasingly shorter lead time on the value chain and stakeholders
  • Improving communications between marketing, planning and manufacturing units for timely product delivery
  • Demonstrate value proposition by understanding customers’ key markets and aligning this with core competencies
  • Exploring possible solutions and operational models for increased flexibility in supply chain management

Steven Fong, Regional Business Director, APJ & Head, Global Pricing Services, Xilinx

Be part of the discussion – email enquiry@iqpc.com.sg if you would like to share a case study or collaborate in determining the roadmap for semiconductors in Asia for the next five years.

Who will You Meet?

Don’t be left out when your peers meet key decision makers from IDMs, Fabless, and Foundries of the following job titles:

Director of Engineering
Director of Manufacturing
Director of Quality Assurance
Director of R&D
Director of Testing
Director of Assembly
Director of Subcontract

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